TRV Series
Vacuum Reflow Oven
TRV Series
Voidless Vacuum Reflow Soldering Solution
The TRV Series is a world-class vacuum reflow system that realizes voidless soldering technology. By reducing solder void area to under 1% during the reflow process, it dramatically increases the electrical reliability and durability of electronic devices.
The TRV Series is the optimal solution for mission-critical industries where a single failure cannot be tolerated, such as automotive electronics, medical devices, military, and aerospace systems.
Push & Go Rail
Innovative PCB Transportation using High-Precision Finger Hook Rails
Due to the high technical difficulty of the vacuum process, many systems experience PCB jamming, collisions, or bottlenecks. To resolve this, TRV departs from traditional chain conveyors to introduce the innovative "Push & Go" board transport system utilizing high-precision Finger Hook rails.
This ensures that boards flow seamlessly and stabilizes production without any board transport mishaps.
Twin Lane & Twin Vacuum
Maximizing Yield and Throughput in Voidless Vacuum Processing
Vacuum reflow ovens perform an additional vacuum stage during reflow to extract solder voids. This vacuum stage naturally causes a bottleneck in the board flow, which can lower the throughput of the entire production line.
The TRV oven resolves this congestion by offering optional Twin Lane and Twin Vacuum configurations, achieving the industry's highest production yield and the shortest cycle (Tact) time.
Bigger PCB Size
Wider Application Coverage for Broad Production Needs
To support a broader range of production needs, the system offers multiple vacuum process sizes:
- Standard: 320 × 240 mm
- Grande: 430 × 330 mm
- Ultra: 600 × 400 mm
This allows manufacturers to process everything from compact electronic modules to large-format PCBs used in automotive, EV, power electronics, aerospace, and industrial applications.
With greater board-size flexibility, customers can select the right vacuum reflow platform for current production while keeping room for future product expansion.
Dual FMS
Double Filtration to Keep the Chamber Clean and Minimize Downtime
The TRV vacuum reflow oven comes standard with two independent Flux Management Systems (FMS). These two systems are strategically placed in the pre-heating and cooling zones where flux outgassing is most concentrated, capturing and removing virtually all flux residue.
This keeps the chamber interior clean and dramatically reduces equipment downtime compared to competitors. The FMS filters are designed with a quick-release mechanism, making maintenance and cleaning simpler than ever.
Real-Time Monitoring
Preventative Quality Control to Eliminate Guesswork and Maximize Yield
Equipped with an intelligent, real-time diagnostic suite, our oven continuously tracks critical thermal and atmospheric data. By shifting from reactive troubleshooting to proactive, preventative care, this system ensures absolute process stability and protects your production line from unseen defects.
- Temperature Profile Monitoring: Continuously tracks thermal uniformity to ensure precise soldering and prevent thermal shock.
- O2 PPM Monitoring: Strictly regulates the inert nitrogen atmosphere, instantly detecting anomalies to eliminate oxidation risks.
- Vacuum Pressure & Purge Monitoring: Guarantees precise, repeatable vacuum levels and tracks purge efficiency for ultimate void reduction.
- Vacuum Process Self-Monitoring: Automated system diagnostics act as your first line of defense, proactively alerting operators to process shifts and upcoming maintenance needs before they impact your yield.
Ready to Upgrade Your Production?
Contact our engineering team to request a customized quote or to schedule a technical consultation for the TRV Series Vacuum Reflow Oven.