Core Thermal Systems
TRV Series Vacuum Oven
Engineered for ultra-reliable automotive, medical, and aerospace board assemblies. By drawing a vacuum during the liquidus stage, the TRV series removes bubbles and gases, guaranteeing zero-defect joint integrity.
- ▪ Voidless Soldering: Reduces solder voids to below 1.0% area coverage.
- ▪ Twin Vacuum Option: Supports dual vacuum chamber configuration for double throughput.
- ▪ Push & Go Rails: Finger-hook board feed to support high automation.
TRN Series Nitrogen Oven
Designed for high-precision, low-oxidation SMT operations. Featuring a closed-loop gas recirculation block and active thermal zoning, the TRN Series ensures high joint uniformity while reducing nitrogen gas consumption by 30%.
- ▪ Ultra Purity: Sustains stable PPM nitrogen profiles across heating zones.
- ▪ Triple FMS: Integrated flux management filters block chamber pollution.
- ▪ Insulated Core: Aerospace-grade structural cladding prevents heat loss.
TRA Series Air Convection Oven
An industry classic with over 3,000 installations worldwide. Highly durable blower motors and heavy-duty rails provide consistent forced-air convection, minimizing total operating costs while delivering reliable thermal profiling.
- ▪ Proven Durability: Structural chassis engineered to prevent heat deformation.
- ▪ Blower Performance: Triple-sealed 300W convection fans distribute air evenly.
- ▪ Low Maintenance: Easily accessible heating cells reduce downtime.
ESP Series Nitrogen Generator
An automated PSA nitrogen generation unit designed to stand beside your reflow lines. It communicates actively with ovens to generate high-purity N2 on-demand, saving bulk gas delivery costs and saving factory floor space.
- ▪ High Purity N2: Outputs stable nitrogen concentrations up to 99.99%.
- ▪ Compact Footprint: Minimal floor space requirements and low noise levels (< 55 dBA).
- ▪ Smart Gas Link: Automatically modulates gas output based on line status.
Engineered Solutions by Industry
We optimize reflow ovens for specific industrial requirements, ensuring extreme joint durability, precise thermal profiles, and direct factory line automation.
Automotive Electronics
Zero-defect reliability for safety-critical ADAS, intelligent radar modules, EV powertrain controllers, and power-inverter systems.
Explore SolutionSemiconductor Packaging
High-precision flip-chip back-end packaging, advanced BGA packages, and multi-chip module reflow, fully supporting SECS/GEM and MES smart factory automation.
Explore SolutionBattery & BMS Systems
Precise thermal profiles for oversized power-distribution BMS board assemblies and long-format flexible battery protection PCBs.
Explore SolutionAerospace & Defense
Extreme thermal shock resistance and heavy-duty structural reliability for mission-critical avionic boards and defensive guidance electronics.
Explore SolutionConsumer & Mobile
High-volume throughput with uniform heat distribution, ultra-low N2 gas consumption, and clean atmosphere management.
Explore SolutionReflow, made visible.
The TSM Software Solution is engineered to bring clarity to complexity, control to your fingertips, and speed to your response. It translates millions of complex process data points into a single, highly transparent, and elegant interface.
- Intuitive MMI: Infographic-driven UX displaying temperature, O₂ ppm, and conveyor speed.
- Real-Time Monitoring (RTPM/RPPM): Live thermal profiling and atmospheric oxygen traceability.
- Proactive Safety & Alarms: Continuous monitoring of motors, heaters, and fluid levels to prevent downtime.
Trusted By Global Industry Leaders
